Standard liquid cooling is not enough for the most powerful chips. The advanced cooling technology market provides solutions for heat fluxes exceeding 1000 W/cm², enabling the next generation of high-performance computing and power electronics.

Beyond Standard Liquid Cooling

The [LSI keyword: advanced cooling technology market] includes several innovative approaches. Microchannel heat exchangers: microscopic channels (less than 1 mm) are etched into the cold plate, increasing the surface area for heat transfer. The advanced cooling technology market for microchannel cold plates is used in high-power lasers and in some server CPUs. Jet impingement cooling: a jet of coolant (water or dielectric fluid) is directed at the hot surface, creating a thin, high-velocity boundary layer. The advanced cooling technology market for jet impingement is used in cooling power electronics (IGBTs, MOSFETs). Two-phase immersion cooling: the electronics are immersed in a dielectric fluid that boils, absorbing heat through latent heat of vaporization. The advanced cooling technology market for two-phase immersion is used in supercomputers and in some high-density data centers. The advanced cooling technology market for "condenser" design (how the vapor is condensed back to liquid) is critical. The advanced cooling technology market for "pumped" two-phase (using a pump to circulate a two-phase mixture) is also emerging.

The advanced cooling technology market also includes "heat pipes" and "vapor chambers" (passive two-phase devices) for spreading heat. The advanced cooling technology market for "loop heat pipes" (which can transport heat over longer distances) is used in spacecraft and in some high-end computers. The advanced cooling technology market for "thermosiphons" (gravity-assisted heat pipes) is used in cooling of power transformers and in solar thermal systems. The advanced cooling technology market for "electrohydrodynamic" (EHD) cooling (using electric fields to pump dielectric fluid) is still at the research stage.

Materials and Manufacturing

The advanced cooling technology market relies on advanced materials. Copper is the standard for cold plates, but its corrosion resistance is poor with some coolants. The advanced cooling technology market for "stainless steel" and "titanium" cold plates is used with corrosive coolants. The advanced cooling technology market for "silicon" microchannel coolers (etched directly into the chip) is used in some research prototypes. The advanced cooling technology market for "additive manufacturing" (3D printing) allows complex internal geometries (e.g., triply periodic minimal surfaces) that optimize heat transfer and pressure drop. As the advanced cooling technology market continues to evolve, the focus will be on reducing cost (to make advanced cooling economical for mainstream products), on improving reliability (two-phase systems can be sensitive to orientation), and on integration with the chip (embedded cooling). The advanced cooling technology market is the frontier of thermal management, enabling the exascale computing and ultra-fast charging that the future demands.

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