Advanced Packaging Materials for Semiconductor Market is projected to grow at a Compound Annual Growth Rate (CAGR) of approximately 10% during the forecast period 2025 to 2034.

Global Data Insights Consultancy announces the release of the report "Global Advanced Packaging Materials for Semiconductor Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2034”. This report provides a detailed overview of the market scenario, including a thorough analysis of the market size, sales quantity, average price, revenue, gross margin and market share. The report provides an in-depth analysis of the competitive landscape, manufacturer's profiles, regional and national market dynamics, and the opportunities and challenge that the market may be exposed to in the near future. Global Advanced Packaging Materials for Semiconductor Market research report is a comprehensive analysis of the current market trends, future prospects, and other pivotal factors that drive the market.

The report presents authenticated data derived from extensive primary and secondary research. By analysing historical growth trends and the current market landscape, it aims to provide actionable insights and forecasts for global and regional market growth. It takes into account revenue generated from report sales and related technologies across various application segments while exploring market data tables. Key market factors, including macroeconomic conditions, the overall market environment, government policies, and the competitive landscape, are carefully examined to ensure a comprehensive analysis.

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Competitive Landscape: Advanced Packaging Materials for Semiconductor Market

Some of the major players in the Advanced Packaging Materials for Semiconductor Market are:

1.      Henkel AG & Co. KGaA

2.      Hitachi Chemical Co., Ltd.

3.      Sumitomo Bakelite Co., Ltd.

4.      Shin-Etsu Chemical Co., Ltd.

5.      Kyocera Corporation

6.      LG Chem Ltd.

7.      Showa Denko Materials Co., Ltd. (formerly Hitachi Chemical)

8.      ASM Pacific Technology Ltd.

9.      Sumitomo Chemical Co., Ltd.

10.   Nitto Denko Corporation

11.   DuPont de Nemours, Inc.

12.   Samsung Electro-Mechanics Co., Ltd.

13.   Toray Industries, Inc.

14.   BASF SE

15.   Mitsui Chemicals, Inc.

16.   Ajinomoto Fine-Techno Co., Inc.

17.   TATSUTA Electric Wire & Cable Co., Ltd.

18.   Nagase & Co., Ltd.

19.   Panasonic Holdings Corporation

20.   Hitachi High-Tech Corporation

Recent Development:

In February 2025, ASE Technology Holding Co., the world’s largest chip packaging and testing provider, projected that its advanced packaging and testing revenue would more than double to $1.6 billion in 2025, up from $600 million in 2024. This growth is attributed to the increasing global demand for AI chips, with 75% of the projected revenue expected from leading-edge packaging and 25% from advanced testing.

In April 2024, Ajinomoto Co., Inc., renowned for its Ajinomoto Build-up Film (ABF), announced plans to increase its production capacity by 50% by 2030. ABF is a crucial insulating material used in high-performance CPUs and GPUs. The company has invested 25 billion yen to expand its facilities in Gunma and Kawasaki, aiming to meet the growing demand driven by AI and high-performance computing applications.

In November 2024, Taiwan Semiconductor Manufacturing Company (TSMC) acquired 30 hectares of land in the Southern Taiwan Science Park to establish its first “Advanced Supply Chain Zone.” This zone will focus on advanced packaging to support the CoWoS/SoIC capacities of its upcoming AP7 (Chiayi) and AP8 (Tainan) fabs. TSMC has also organized a development briefing for semiconductor supply chain companies, inviting long-term certified partners to participate.

In December 2024, China’s advanced packaging sector has witnessed a surge in mergers and acquisitions amid the AI boom. Notably, Jiangsu Huahai Chengke New Materials announced plans to acquire Changzhou Huawei Electronics, a leading epoxy molding compound manufacturer. Additionally, Huatai Chemical acquired POME, a key supplier of polyimide materials critical for advanced semiconductor packaging. These strategic moves aim to enhance China’s competitiveness in the semiconductor materials sector.

Segmentation of Advanced Packaging Materials for Semiconductor Market

By Material Type Outlook (Revenue, USD Billion, 2020 – 2034)

Substrate Materials

Organic Substrates

Ceramic Substrates

Metal Core Substrates

Encapsulation Materials

Epoxy Molding Compounds (EMC)

Silicone Encapsulants

Polyimides

Interconnect Materials

Solder Materials

Conductive Adhesives

Underfill Materials

Dielectric Materials

Liquid Crystal Polymers (LCP)

Benzocyclobutene (BCB)

Polybenzoxazole (PBO)

By Packaging Technology Outlook (Revenue, USD Billion, 2020 – 2034)

System in Package (SiP)

3D Packaging (Through Silicon Via – TSV)

Flip Chip Packaging

Wafer-Level Packaging (WLP)

Fan-Out Wafer-Level Packaging (FOWLP)

By Application Outlook (Revenue, USD Billion, 2020 – 2034)

Consumer Electronics

Automotive Electronics

Industrial Electronics

Healthcare and Medical Devices

Telecommunications

Data Centers and Servers

By End-User Outlook (Revenue, USD Billion, 2020 – 2034)

Semiconductor Manufacturers

Electronics OEMs (Original Equipment Manufacturers)

Foundries

Packaging and Testing Companies

Advanced Packaging Materials for Semiconductor Market Regional Analysis

North America (USA and Canada)

Europe (UK, Germany, France and rest of Europe)

Asia-Pacific (China, Japan, India, and Rest of Asia Pacific)

Latin America (Brazil, Mexico, and Rest of Latin America)

Middle East and Africa (GCC and Rest of the Middle East and Africa)

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Important Features of the reports:

- Detailed analysis of the Advanced Packaging Materials for Semiconductor Market

- Fluctuating market dynamics of the industry

- Detailed Advanced Packaging Materials for Semiconductor Market segmentation

- Historical, current and projected market size in terms of volume and value

- Recent industry trends and developments

- Competitive landscape of the Advanced Packaging Materials for Semiconductor Market

- Strategies of key players and product offerings

- Potential and niche segments/regions exhibiting promising growth

- A neutral perspective towards Advanced Packaging Materials for Semiconductor Market performance.

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